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Press Room | Kester

(South Plainfield, NJ USA) – April 25, 2022 – MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor Divisions, in partnership with Globalspec will host “Low Temperature Solder Solutions for Defect-free Next Generation Package Designs” webinar presented by Paul Salerno, Global Portfolio Manager for SMT Solutions on Wednesday, May 25 at 2:00 pm EDT.

 

Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.

 

Topics to be covered during this webinar include:

  • Develop an understanding of distinct differences between traditional SnBi alloys and next generation low temperature alloys, such as HRL1
  • Compare drop shock and thermal cycling data for HRL3 to baseline surface mount technology (SMT) alloys, such as SAC305
  • Detail the effect low temperature solders have on warpage induced defects, such as non-wet-open (NWO) and head-in-pillow (HiP)
  • Learn how low temperature solders have the potential to enable next generation package designs.

 

To register for the panel, please visit the Globalspec registration page (Link).  

 

For additional information on the Assembly portfolio of solutions to optimize process flexibility and enhance reliability in PCB assemblies, please visit macdermidalpha.com.

 

About MacDermid Alpha Electronics Solutions:

Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain.  The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients.  Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.