Products

TSF-8818HF

Kester TSF-8818HF is a water-soluble, tacky soldering flux formula with a unique halogen-free activator system. TSF-8818HF is designed to have high tackiness to minimize component movement and misalignment during reflow, especially thin flip chip dice. TSF-8818HF is highly active even without halogens and can be used as a drop-in replacement for a variety of metallurgies including typical tin-lead eutectic and higher melting point lead-free alloys.

Find Channel Partner

SDS

Product Offerings
Data Sheets

Halogen Content	Description	Part #	Type	Process	Application	Package
Halogen-Free	TSF-8818HF 30g SYR	301903	Water-Soluble	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP

TSF-8818HF Data Sheet
TSF-8818HF RoHS Declaration