Products

TSF-6852

Kester TSF-6852 is a synthetic water-soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long-term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies including low melting point alloys, typical tin-lead eutectic alloys and the higher melting point, lead-free alloys. TSF-6852 is classified as ORH1.

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Data Sheets

Halogen Content	Description	Part #	Type	Process	Application	Package
Contains Halogen	TSF-6852 30g SYR	300203	Water-Soluble	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen	TSF-6852 100g JAR	300204	Water-Soluble	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen	TSF-6852 15g SYR	300214	Water-Soluble	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP
Contains Halogen	TSF-6852 165g CRT	301706	Water-Soluble	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Package on Package, SiP, Wafer CSP

Products

TSF-6852

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