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TSF-6592

TSF-6592

Kester TSF-6592 is a no-clean paste flux designed as a lead-free solution for an array of lead-free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any lead-free soldering application that requires a very tacky flux. Share
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Halogen Content Description Part # Type Process Application Package
Contains Halogen TSF-6592 30g SYR 300703 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592 150g CRT 300705 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592 5g SYR 300726 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592 3RM 5g SYR 302326 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF6592 10g S 42000044 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF6592 30g S 42000045 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF6592 50g J 42000060 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592 10g SYR 300702 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP
Contains Halogen TSF-6592 100g JAR 300704 No-Clean Printing, Dipping, Dispensing Flip Chip Attach, Ball Attach, Solder Ball Attach Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Package on Package, SiP, Wafer CSP

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