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TSF-6522

TSF-6522

Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing TSF-6522 under a vacuum environment. TSF-6522 is classified as ROL0. Share
Halogen Content Description Part # Type Process Package
Contains Halogen TSF-6522 10g SYR 900402 No-Clean Printing, Dipping, Dispensing Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Chip on Flex, Lid Attach, SiP, Wafer CSP
Contains Halogen TSF-6522 30g SYR 900403 No-Clean Printing, Dipping, Dispensing Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Chip on Flex, Lid Attach, SiP, Wafer CSP
Contains Halogen TSF-6522 100g JAR 900404 No-Clean Printing, Dipping, Dispensing Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Chip on Flex, Lid Attach, SiP, Wafer CSP
Contains Halogen TSF-6522 150g CRT 900405 No-Clean Printing, Dipping, Dispensing Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN, Chip on Flex, Lid Attach, SiP, Wafer CSP

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