Products

TSF-6521C

Kester TSF-6521C is a no-clean tacky soldering flux that exhibits a very high level of tack. TSF-6521C is designed for pick and place machines that are constantly moving the PCB at high speed doing component placement. The higher level of tack will help in limiting the amount of component displacement during component placement. TSF-6521C can be used in high speed dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6521C can also be printed utilizing standard stencil and printer parameters.

Due to changes in REACH Regulations, this product is no longer sold into Europe or to European customers.

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Data Sheets

Halogen Content	Description	Part #	Type	Application	Package	Notes
Contains Halogen	TSF-6521C 30g SYR	300503	No-Clean	Flip Chip Attach, Ball Attach, Solder Ball Attach	Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Systems
Contains Halogen	TSF-6521C 150g CRT	300505	No-Clean	Flip Chip Attach, Ball Attach, Solder Ball Attach	Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Systems
Contains Halogen	TSF-6521C 100g JAR	300504	No-Clean	Flip Chip Attach, Ball Attach, Solder Ball Attach	Flip Chip BGA, Wire Bond BGA, Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Systems

TSF-6521C Data Sheet

Products

TSF-6521C

Process Compatible Products

985M Soldering Flux

275 Flux-Cored Wire