Products

TSF-6502JCR

Kester TSF-6502JCR is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502JCR will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502JCR will leave aesthetically pleasing clear residues on the assembly. TSF-6502JCR is designed for a wide range of temperature and humidity conditions.

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Data Sheets

Halogen Content	Description	Part #	Type	Process	Application	Package	Notes
Contains Halogen	TSF-6502JCR 30g SYR	300103	No-Clean	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Solders
Contains Halogen	TSF-6502JCR 100	300104	No-Clean	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Solders
Contains Halogen	TSF-6502JCR 150 CRT	300105	No-Clean	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Solders
Contains Halogen	TSF-6502JCR 10g S	42500043	No-Clean	Printing, Dipping, Dispensing	Flip Chip Attach, Ball Attach, Solder Ball Attach	Wire Bond BGA, Flip Chip BGA, Wire Bond CSP, Flip Chip CSP, Flip Chip on Board, Traditional Leadframe, QFN	Works Best with SnPb Solders