Products

NP560 Solder Paste

NP560 is a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.

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Data Sheets

Alloy	Powder Size	Type	Halogen Content	Lead Content	Description	Part #	Process
Sn96.5Ag3.0Cu0.5	4	No-Clean	Halogen-Free	Lead-Free	NP560 Sn96.5Ag3.0Cu0.5 T4 88.3% 500g JAR	7048230910	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	4	No-Clean	Halogen-Free	Lead-Free	NP560 Sn96.5Ag3.0Cu0.5 T4 88.3% 600g CRT	7048230911	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	4	No-Clean	Halogen-Free	Lead-Free	NP560 Sn96.5Ag3.0Cu0.5 T4 86.5% 100g SYR	7048250904	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	5	No-Clean	Halogen-Free	Lead-Free	NP560 Sn96.5Ag3.0Cu0.5 T5 88% 500g JAR	7048062210	Screen/Stencil Printing