Products

EM907 Solder Paste

Kester EM907 is a lead-free, air and nitrogen reflowable, no-clean solder paste specifically designed for the thermal requirements of lead-free alloys, including the SAC305 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. EM907 is capable of stencil printing downtimes up to 60 minutes with an effective first print down to 20 mils without any kneading. EM907 also exhibits excellent continual printability for fine pitch (0.4mm/16 mils) and is able to print at high speeds up to 6 in/s (150 mm/s).

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Data Sheets

Alloy	Powder Size	Type	Halogen Content	Lead Content	Description	Part #	Process
Sn96.5Ag3.0Cu0.5	3	No-Clean	Contains Halogen	Lead-Free	EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 500g JAR	7006050810	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	3	No-Clean	Contains Halogen	Lead-Free	EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 600g CRT	7006050811	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	3	No-Clean	Contains Halogen	Lead-Free	EM907 Sn96.5Ag3.0Cu0.5 T3 88.5% 750g DEK	7006050819	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	4	No-Clean	Contains Halogen	Lead-Free	EM907 Sn96.5Ag3.0Cu0.5 T4 88.5% 500g JAR	7006050910	Screen/Stencil Printing
Sn96.5Ag3.0Cu0.5	4	No-Clean	Contains Halogen	Lead-Free	EM907 Sn96.5Ag3.0Cu0.5 T4 88.5% 600g CRT	7006050911	Screen/Stencil Printing
Sn96.5Ag3Cu0.5	3	No-Clean	Contains Halogen	Lead-Free	EM907 11.5% Sn96.5Ag3Cu0.5 25-45µ 500g J	41500605	Screen/Stencil Printing
Sn96.5Ag3Cu0.5	4	No-Clean	Contains Halogen	Lead-Free	EM907 11.5% Sn96.5Ag3Cu0.5 20-38µ 500g J	41500607	Screen/Stencil Printing

Products

EM907 Solder Paste

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