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EM808 Solder Paste

EM808 Solder Paste

Kester EM808 is a lead-free, organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, EM808 provides hours of stable stencil life, tack time and repeatable brick definition. EM808 robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the EM808 is very aggressive and  provides superior wetting to OSP coated and Immersion Silver boards. Share
Alloy Powder Size Type Halogen Content Lead Content Description Part # Process
Sn96.5Ag3.0Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM808 Sn96.5Ag3.0Cu0.5 T3 88% 500g CRT 7003060823 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM808 12% Sn96.5Ag3Cu0.5 25-45µ 500g J 41500350 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 3 Water-Soluble Contains Halogen Lead-Free EM808 12% Sn96.5Ag3Cu0.5 25-45µ 600g C 41500471 Screen/Stencil Printing
Sn96.5Ag3Cu0.5 4 Water-Soluble Contains Halogen Lead-Free PA2987 - EM808 965A3C05 1100 40 500J 7003160910 Screen/Stencil Printing

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