ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.
Through the selection of products, and their ability to balance viscosity, preheat, reworkability, and mechanical strength properties, users can perfectly match an ALPHA HiTech Underfill with their specific device needs, optimizing high throughput assembly.