Kester - Thermal Interface Material

Kester has experience dissipating the heat in various types of applications such as radiators/heat exchangers, die attach and microprocessor.

A metal or solder based solution provides many benefits such as:

• High thermal conductivity (see Table 1)
• Lead-Free
• Various form factor availability

Applications:

As technology drivers push electronics and semiconductors for greater functionality, this affects proportionally the technology improvement demand for thermal dissipation or interface materials. Kester has devoted resources to develop the next generation of TIM’s and innovative non-adhesive options. An example of a high performance application in which the traditional organic technology has approached the typical iterative improvement cycle is with microprocessors. The next generation of TIM’s to support further thermal dissipation performance goals has concluded that TIM solutions by Kester is the interconnect solution.

Whether your thermal dissipation issues lie at the die level or at TIM2, Kester has created interconnect solutions to enable your next generation applications.

Note: TIM2 is referred to the thermal management material solution between the heat spreader/lid to an active or passive heat sink. The heat sinks, whether active or passive, are used to dissipate the heat generated by a microprocessor.

Another application space of solder based thermal management solutions from Kester is in the area of die attach for Metal Oxide Semiconductor Field Effect Transistor (MOSFET).

The high purity and consistency of materials supplied by Kester has become the defacto standard specification for global Semiconductor packaging corporations.

Material Options:

Kester has been a manufacturer of solder products for 105+ years and is an expert in manipulating metal interconnection solutions or thermal management materials into various geometries. With facilities around the globe, Kester has the ability to offer material solutions in an array of compositions and chemistries based on your specific application demands. Many material solutions are listed in the table below.

For examples of geometry and packaging formats click here.